DDR2DIMM|DDR3DIMM,DDR3SODIMM 特性:
Number of Positions:240
Centerline (Pitch) (mm)1行
间距 (mm)1.9-6.3
AMPMODU|AMPMODU 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
Modular Jacks&Plugs|SE 特性:
Number of Positions:4-10
工组温度范围 (°C)-55-155
MATE-N-LOK|Universal MATE-N-LOK 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant,Not Compliant
Modular Jacks&Plugs|MiniPCI,MultiIO 特性:
Number of Positions:4-10
工组温度范围 (°C)-55-155
AMPLIMITE|RC,Standard 特性:
Number of Positions:3-120
Centerline (Pitch)(mm)0.64-2.77
sealable:否
Contact Current Rating (Max) (A)1.5-60
工组温度范围 (°C)-55-125
AMPMODU|Blank,L 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
0.8mmFH|.8mmFH 特性:
Number of Positions:40-200
堆叠高度 (mm)5-22
端子接触部电镀厚度 (μm)0.2-0.76
AMPLIMITE|AMPLIMITE Kit 特性:
Number of Positions:3-120
Centerline (Pitch)(mm)0.64-2.77
sealable:否
Contact Current Rating (Max) (A)1.5-60
工组温度范围 (°C)-55-125
MTA|SL-156 特性:
Number of Positions:1-28
Centerline (Pitch) (mm)2.5-5.08
Contact Current Rating (Max) (A)4-14.24
工组温度范围 (°C)-55-105
MTA|MTA156 特性:
Number of Positions:1-28
Centerline (Pitch) (mm)2.5-5.08
Contact Current Rating (Max) (A)4-14.24
工组温度范围 (°C)-55-105
CHAMP|Standard CHAMP Products 特性:
Number of Positions:14-64
Centerline (Pitch) (mm)2.16