AMP-LATCH|AMP MODU 特性:
Number of Positions:6-100
Centerline (Pitch)(mm)0.64-2.54
Contact Current Rating (Max) (A)0.5-1
工组温度范围 (°C)-65-105
HDC|HDC HDInsert,HDC Inserts 特性:
Number of Positions:1-108
Centerline (Pitch)(mm)5.8
Contact Current Rating (Max) (A)5-350
工组温度范围 (°C)-55-150
AMPLIMITE|Solder CupConnectors 特性:
Number of Positions:3-120
Centerline (Pitch)(mm)0.64-2.77
sealable:否
Contact Current Rating (Max) (A)1.5-60
工组温度范围 (°C)-55-125
AMP|CNT,PCN 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant,Not Compliant
AMP 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant,Not Compliant
AMP|TH/.025 Connector System 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant,Not Compliant
HPI|HDR 特性:
Number of Positions:2-32
Centerline (Pitch) (mm)1-2.5
Contact Current Rating (Max) (A)0.8-3
工组温度范围 (°C)-55-105
AMP|Multilock Connector System 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant,Not Compliant
AMP|Econoseal,Econoseal J-MarkII 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant,Not Compliant
AMP|MCON Inter connection System 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant,Not Compliant
AMPLIMITE|AMPLIMITE 特性:
Number of Positions:3-120
Centerline (Pitch)(mm)0.64-2.77
sealable:否
Contact Current Rating (Max) (A)1.5-60
工组温度范围 (°C)-55-125
Modular Jacks&Plugs|Mini PCI 特性:
Number of Positions:4-10
工组温度范围 (°C)-55-155