AMPMODU|AMPMODUIV/V 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
AMPMODU 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
AMPMODU|AMPMODU Headers 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
AMPMODU|AMPMODUMTE 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
AMP-LATCH|AMP MODU 特性:
Number of Positions:6-100
Centerline (Pitch)(mm)0.64-2.54
Contact Current Rating (Max) (A)0.5-1
工组温度范围 (°C)-65-105
SIM Card|SIM Connectors 特性:
Number of Positions:20
Centerline (Pitch) (mm)1.1-2.54
端子数量:6-20
Contact Current Rating (Max) (A)0.3
工组温度范围 (°C)-40-85
FPC|FPC 特性:
Number of Positions:1-55
Centerline (Pitch) (mm)0.5-1.25
高度 (mm)2-7.8
宽度 (mm)3-9
柔性电缆粗度 (mm)0.3
Contact Current Rating (Max) (A)0.5-1
工组温度范围 (°C)-55-125
LGA Sockets|LGH 特性:
Number of Positions:771-3647Contact Current Rating (Max) (A)0.5工组温度范围 (°C)-25-105
High Definition Multimedia Interface(HDMI)|HDMI TypeA Standard 特性:
端口数量:1-2
Number of Positions:19-38
工组温度范围 (°C)-55-105
Modular Jacks&Plugs|Mini PCI 特性:
Number of Positions:4-10
工组温度范围 (°C)-55-155