PGA Sockets|PKA 特性:
Number of Positions:321-350
端子接触部电镀厚度 (μin)10-15
封装数量12-120
PCCard|STS 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|RRD,RSS 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
AMPMODU|Eurocard,IAC 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
AMPMODU|Tandem Spring 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
AMPMODU|AMPMODU,Tandem Spring 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
AMPMODU|HDI,MINIPAKHDL 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
PCCard|AMP-HDI,HDI 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
MiniPCI,PCF 特性:
Number of Positions:1-52
Centerline (Pitch) (mm)0.8-6.05
DDR2DIMM|DRD 特性:
Number of Positions:240
Centerline (Pitch) (mm)1
行间距 (mm)1.9-6.3
XFP|XFP 特性:
EU RoHS Compliance:Compliant
产品系列:XFP
ThermalSolutions|HS,HSS 特性:
散热片数量:1-7