ThermalSolutions|CL 特性:
散热片数量:1-7
Compact Flash|SC10 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
Compact Flash|HD.50 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
Thermal Solutions|PH,PRHS 特性:
散热片数量:1-7
Thermal Solutions|HS,PKA 特性:
散热片数量:1-7
Thermal Solutions|CL,HA.32 特性:
散热片数量:1-7
DDR3 SODIMM|STA,STA.20 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
DDR3 DIMM 特性:
Centerline (Pitch) (mm)1-2
行间距 (mm)0.95-5.3
DDR3 SODIMM|RKS,RVS 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
MicroPitch Sockets|HS,HSM 特性:
产品系列:AMP
MicroPitch Sockets|MP,PKS 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant
MicroPitch Sockets|PT/SPT,SKT 特性:
Number of Positions:1-320
Centerline (Pitch) (mm)0.8-5.2
Contact Current Rating (Max) (A)1.5-200
工组温度范围 (°C)-55-150