HPI|AMPMODU 特性:
Number of Positions:2-32
Centerline (Pitch) (mm)1-2.5
Contact Current Rating (Max) (A)0.8-3
工组温度范围 (°C)-55-105
Nanonics|DUALOBE,SM 特性:
Number of Positions:2-65
Centerline (Pitch) (mm)0.64-1.1
工组温度范围 (°C)-55-200
LowPowerDrawer|MiniCTDrawer 特性:
Number of Positions:6-60
Centerline (Pitch) (mm)1.5-12
Contact Current Rating (Max) (A)1-15
工组温度范围 (°C)-30-120
LowProfile WireToBoard|LowProfile Wire-to-Board 特性:
Number of Positions:1-15
Centerline (Pitch) (mm)0.8
Contact Current Rating (Max) (A)0.5-6
工组温度范围 (°C)-25-65
RAST|RAST5IDCConnectors,RAST5D 特性:
Number of Positions:1-96
Centerline (Pitch) (mm)2.5-15.11
Contact Current Rating (Max) (A)2-35
工组温度范围 (°C)-55-140
MTEI Series|MTEI 特性:
Number of Positions:2-20
Centerline (Pitch) (mm)2.5
Contact Current Rating (Max) (A)2-3.5
工组温度范围 (°C)-20-95
AMPCT|AMPCT 特性:
Number of Positions:2-30
Centerline (Pitch) (mm)2
Contact Current Rating (Max) (A)2-4
工组温度范围 (°C)-40-221
Economy Power|Economy Power2.5 特性:
Number of Positions:1-40
Centerline (Pitch)(mm)2.5-11
sealable:否
Contact Current Rating (Max) (A)3-250
Circuit Application:power
工组温度范围 (°C)-55-105
HPI|HDI,HPI 特性:
Number of Positions:2-32
Centerline (Pitch) (mm)1-2.5
Contact Current Rating (Max) (A)0.8-3
工组温度范围 (°C)-55-105
MIS|MIS 特性:
Number of Positions:2-15
Centerline (Pitch) (mm)1.25-2.5
Contact Current Rating (Max) (A)1-3.5
工组温度范围 (°C)-40-105
AMP MINI-CT|AMP MiniCT 特性:
Number of Positions:2-40
Centerline (Pitch) (mm)1.5
Contact Current Rating (Max) (A)2-7
工组温度范围 (°C)-65-221
Buchanan|Terminal BlockOne PcBDMT 特性:
Number of Positions:1-163
Centerline (Pitch)(mm)0.6-30.23
Connector System:缆到缆
sealable:否
Contact Current Rating (Max) (A)0.5-65
工组温度范围 (°C)-60-160