DDR1 and DDR2 SODIMM|2000P 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
SIM Card|SIM Connectors 特性:
Number of Positions:20
Centerline (Pitch) (mm)1.1-2.54
端子数量:6-20
Contact Current Rating (Max) (A)0.3
工组温度范围 (°C)-40-85
LGA Sockets|LGH 特性:
Number of Positions:771-3647Contact Current Rating (Max) (A)0.5工组温度范围 (°C)-25-105
DDR3DIMM|DDR3DIMM,DDR3SODIMM 特性:
Centerline (Pitch) (mm)1-2行
间距 (mm)0.95-5.3
DDR2DIMM|DDR3DIMM,DDR3SODIMM 特性:
Number of Positions:240
Centerline (Pitch) (mm)1行
间距 (mm)1.9-6.3
MINI-SPRING SOCKETS|Series4 特性:
插座长度 (mm)3.51-7.82
线缆尺寸 (mm2)0.0404-0.126
Contact Current Rating (Max) (A)3-7.5
工组温度范围 (°C)-65-126
MINI-SPRINGSOCKETS|Series5 特性:
插座长度 (mm)3.51-7.82
线缆尺寸 (mm2)0.0404-0.126
Contact Current Rating (Max) (A)3-7.5
工组温度范围 (°C)-65-126
PCI EXPRESS 特性:
Number of Positions:36-280
Centerline (Pitch) (mm)1-1.27
Contact Current Rating (Max) (A)1
工组温度范围 (°C)-55-105
MINI-SPRING SOCKETS|Series3 特性:
插座长度 (mm)3.51-7.82
线缆尺寸 (mm2)0.0404-0.126
Contact Current Rating (Max) (A)3-7.5
工组温度范围 (°C)-65-126
DDR1 and DDR2 SODIMM|DDR2 SODIMM,SODIMM 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
DDR1 and DDR2 SODIMM|DDR SODIMM,DDR2 SODIMM 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
DIMM 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
MiniPCI Express|MiniPCI,MiniPCI Express 特性:
Centerline (Pitch) (mm)0.8-6.05
堆叠高度 (mm)4-8
SODIMM|DDR2 SODIMM,SKT 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
SDCard 特性:
Number of Positions:8-9
Centerline (Pitch) (mm)1.1
DDR1andDDR2SODIMM|DDR2SODIMM,RVS 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
SODIMM|SKT,SODIMM 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
HOLTITE|HOLTITE 特性:
Number of Positions:1-24
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)3-5
工组温度范围 (°C)-65-125
MiniPCI|FPX 特性:
Number of Positions:1-52
Centerline (Pitch) (mm)0.8-6.05
MINI-SPRING SOCKETS|Series1 特性:
插座长度 (mm)3.51-7.82
线缆尺寸 (mm2)0.0404-0.126
Contact Current Rating (Max) (A)3-7.5
工组温度范围 (°C)-65-126