SFP|SFP,SFP+ 特性:
标准:INF-8074i
行业:数据通信
ThermalSolutions|HS,HSS 特性:
散热片数量:1-7
PGA Sockets 特性:
Number of Positions:321-350
端子接触部电镀厚度 (μin)10-15
封装数量12-120
General,LGH 特性:
产品系列:AMP
行业:国防军事,航空航天
LGA Sockets 特性:
Number of Positions:771-3647
Contact Current Rating (Max) (A)0.5
工组温度范围 (°C)-25-105
DIPLOMATE|LE 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
DDR1 and DDR2 SODIMM|STS 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
DDR2 DIMM 特性:
Number of Positions:240
Centerline (Pitch) (mm)1
行间距 (mm)1.9-6.3
SODIMM|SKT,U 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
MINI-SPRING SOCKETS|Series2 特性:
插座长度 (mm)3.51-7.82
线缆尺寸 (mm2)0.0404-0.126
Contact Current Rating (Max) (A)3-7.5
工组温度范围 (°C)-65-126
SIMM|PKS 特性:
Number of Positions:72-90
AMPECONOMATE|AMPECONOMATE,AMPPACE 特性:
Number of Positions:10-35
Centerline (Pitch) (mm)2.54-3.96
Contact Current Rating (Max) (A)3
工组温度范围 (°C)-65-125