MATE-N-LOK|Mini-Universal MATE-N-LOK 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant,Not Compliant
MATE-N-LOK|Commercial MATE-N-LOK 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant,Not Compliant
AMPLIMITE|Solder CupConnectors 特性:
Number of Positions:3-120
Centerline (Pitch)(mm)0.64-2.77
sealable:否
Contact Current Rating (Max) (A)1.5-60
工组温度范围 (°C)-55-125
AMP-LATCH|Universal Headers 特性:
Number of Positions:6-100
Centerline (Pitch)(mm)0.64-2.54
Contact Current Rating (Max) (A)0.5-1
工组温度范围 (°C)-65-105
CHAMP|.050CHAMP SeriesI 特性:
Number of Positions:14-64
Centerline (Pitch) (mm)2.16
Universal SerialBus|A 特性:
端口数量:1-4
Number of Positions:4-24
Centerline (Pitch) (mm)0.5-2.5
Contact Current Rating (Max) (A)0.25-5
工组温度范围 (°C)-55-105
AMP-LATCH|LowProfile Headers 特性:
Number of Positions:6-100
Centerline (Pitch)(mm)0.64-2.54
Contact Current Rating (Max) (A)0.5-1
工组温度范围 (°C)-65-105
AMPLIMITE|AMPLIMITE 特性:
Number of Positions:3-120
Centerline (Pitch)(mm)0.64-2.77
sealable:否
Contact Current Rating (Max) (A)1.5-60
工组温度范围 (°C)-55-125
Modular Jacks&Plugs|Mini PCI 特性:
Number of Positions:4-10
工组温度范围 (°C)-55-155
AMPLIMITE|MetalShell 特性:
Number of Positions:3-120
Centerline (Pitch)(mm)0.64-2.77
sealable:否
Contact Current Rating (Max) (A)1.5-60
工组温度范围 (°C)-55-125
Battery Pack Connector|MDI 特性:
EU RoHS Compliance:Compliant,Not Compliant
DDR3DIMM|DDR3DIMM,DDR3SODIMM 特性:
Centerline (Pitch) (mm)1-2行
间距 (mm)0.95-5.3