Thermal Solutions|HS,PKA 特性:
散热片数量:1-7
Thermal Solutions|CL,HA.32 特性:
散热片数量:1-7
AMPMINI-CT|MiniCTDrawer 特性:
Number of Positions:2-40
Centerline (Pitch) (mm)1.5
Contact Current Rating (Max) (A)2-7
工组温度范围 (°C)-65-221
DDR3 SODIMM|STA,STA.20 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
DDR3 DIMM 特性:
Centerline (Pitch) (mm)1-2
行间距 (mm)0.95-5.3
DDR3 SODIMM|RKS,RVS 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
AMPLIMITE|AMPMODU 特性:
Number of Positions:3-120
Centerline (Pitch)(mm)0.64-2.77
sealable:否
Contact Current Rating (Max) (A)1.5-60
工组温度范围 (°C)-55-125
AMPMODU|Maxi Power Timer 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
AMP|AMPMODU,MRD 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant,Not Compliant
AMPMODU,HEE.46 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
SerialI/O|IEEE1394 特性:
连接器种类:插头,母端
CompactFlash|HPR 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
AMPMODU|HS,HSM 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
PCCard|RE 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
MRJ21|MiniPCI,MultiIO 特性:
Number of Positions:48
AMPMODU|TERMINAL 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
SmartCard|FPC,SC 特性:
Number of Positions:6-8
AMPMODU|AMPMODU,PCF 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
Modular Jacks&Plugs|CAP,MiniPCI 特性:
Number of Positions:4-10
工组温度范围 (°C)-55-155
SDCard|STA 特性:
Number of Positions:8-9
Centerline (Pitch) (mm)1.1
LGA Sockets|LGH,SBP 特性:
Number of Positions:771-3647
Contact Current Rating (Max) (A)0.5
工组温度范围 (°C)-25-105
Modular Jacks&Plugs|MiniPCI,MiniPCI Express 特性:
Number of Positions:4-10
工组温度范围 (°C)-55-155
SODIMM|H,SKT 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
DIMM|DDR3 DIMM,LR 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
DDR3DIMM|FST 特性:
Centerline (Pitch) (mm)1-2
行间距 (mm)0.95-5.3
DDR3SODIMM 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
ModularJacks&Plugs|HT,MiniPCI 特性:
Number of Positions:4-10
工组温度范围 (°C)-55-155
MiniPCI,RVS 特性:
Number of Positions:1-52
Centerline (Pitch) (mm)0.8-6.05
AMPMINI-CT|Cable Assembly MiniCT4pos 特性:
Number of Positions:2-40
Centerline (Pitch) (mm)1.5
Contact Current Rating (Max) (A)2-7
工组温度范围 (°C)-65-221
AMPMINI-CT|Cable Assembly MiniCT5pos. 特性:
Number of Positions:2-40
Centerline (Pitch) (mm)1.5
Contact Current Rating (Max) (A)2-7
工组温度范围 (°C)-65-221