Modular Jacks&Plugs|MiniPCI,SOL 特性:
Number of Positions:4-10
工组温度范围 (°C)-55-155
Standard Coax|MiniPCI,PCF 特性:
Number of Positions:3
sealable:否
AMPMODU|CN 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
AMPMODU|AMPMODU,REL 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
Microdot|MiniPCI,PCF 特性:
Number of Positions:1-187
Centerline (Pitch) (mm)1.27
Contact Current Rating (Max) (A)3
工组温度范围 (°C)-65-165
Compact Flash|SC10 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
Compact Flash|HD.50 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
Thermal Solutions|PH,PRHS 特性:
散热片数量:1-7
MiniPCI,MultiIO 特性:
Number of Positions:1-52
Centerline (Pitch) (mm)0.8-6.05
AMP MODU|EMGLatch 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
Thermal Solutions|HS,PKA 特性:
散热片数量:1-7
Thermal Solutions|CL,HA.32 特性:
散热片数量:1-7
AMPMINI-CT|MiniCTDrawer 特性:
Number of Positions:2-40
Centerline (Pitch) (mm)1.5
Contact Current Rating (Max) (A)2-7
工组温度范围 (°C)-65-221
DDR3 SODIMM|STA,STA.20 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
DDR3 DIMM 特性:
Centerline (Pitch) (mm)1-2
行间距 (mm)0.95-5.3
DDR3 SODIMM|RKS,RVS 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
AMPLIMITE|AMPMODU 特性:
Number of Positions:3-120
Centerline (Pitch)(mm)0.64-2.77
sealable:否
Contact Current Rating (Max) (A)1.5-60
工组温度范围 (°C)-55-125
AMPMODU|Maxi Power Timer 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130
AMP|AMPMODU,MRD 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant,Not Compliant
AMPMODU,HEE.46 特性:
Number of Positions:1-240
Centerline (Pitch)(mm)0.6-10.16
Contact Current Rating (Max) (A)0.5-75
Circuit Application: signal
工组温度范围 (°C)-65-130