DDR1 and DDR2 SODIMM|2000P 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
SIM Card|SIM Connectors 特性:
Number of Positions:20
Centerline (Pitch) (mm)1.1-2.54
端子数量:6-20
Contact Current Rating (Max) (A)0.3
工组温度范围 (°C)-40-85
LGA Sockets|LGH 特性:
Number of Positions:771-3647Contact Current Rating (Max) (A)0.5工组温度范围 (°C)-25-105
DDR3DIMM|DDR3DIMM,DDR3SODIMM 特性:
Centerline (Pitch) (mm)1-2行
间距 (mm)0.95-5.3
DDR2DIMM|DDR3DIMM,DDR3SODIMM 特性:
Number of Positions:240
Centerline (Pitch) (mm)1行
间距 (mm)1.9-6.3
MINI-SPRING SOCKETS|Series4 特性:
插座长度 (mm)3.51-7.82
线缆尺寸 (mm2)0.0404-0.126
Contact Current Rating (Max) (A)3-7.5
工组温度范围 (°C)-65-126
MINI-SPRINGSOCKETS|Series5 特性:
插座长度 (mm)3.51-7.82
线缆尺寸 (mm2)0.0404-0.126
Contact Current Rating (Max) (A)3-7.5
工组温度范围 (°C)-65-126
PCI EXPRESS 特性:
Number of Positions:36-280
Centerline (Pitch) (mm)1-1.27
Contact Current Rating (Max) (A)1
工组温度范围 (°C)-55-105
MINI-SPRING SOCKETS|Series3 特性:
插座长度 (mm)3.51-7.82
线缆尺寸 (mm2)0.0404-0.126
Contact Current Rating (Max) (A)3-7.5
工组温度范围 (°C)-65-126
DDR1 and DDR2 SODIMM|DDR2 SODIMM,SODIMM 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
DDR1 and DDR2 SODIMM|DDR SODIMM,DDR2 SODIMM 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
DIMM 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
MiniPCI Express|MiniPCI,MiniPCI Express 特性:
Centerline (Pitch) (mm)0.8-6.05
堆叠高度 (mm)4-8
SODIMM|DDR2 SODIMM,SKT 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
SDCard 特性:
Number of Positions:8-9
Centerline (Pitch) (mm)1.1
DDR1andDDR2SODIMM|DDR2SODIMM,RVS 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
SODIMM|SKT,SODIMM 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
HOLTITE|HOLTITE 特性:
Number of Positions:1-24
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)3-5
工组温度范围 (°C)-65-125
MiniPCI|FPX 特性:
Number of Positions:1-52
Centerline (Pitch) (mm)0.8-6.05
MINI-SPRING SOCKETS|Series1 特性:
插座长度 (mm)3.51-7.82
线缆尺寸 (mm2)0.0404-0.126
Contact Current Rating (Max) (A)3-7.5
工组温度范围 (°C)-65-126
DIMM|PB,SKT 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
DIMM|PB 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
DIMM|SKT 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
DIMM|DRD,SKT 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
DIMM|DRD,PB 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
MICRO-EDGE|ME,PB 特性:
Number of Positions:72-80
SODIMM|PB,SODIMM 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
MICRO-EDGE|H,SIMM 特性:
Number of Positions:72-80
DIPLOMATE|800Series 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
MicroPitch Sockets|PKS 特性:
Number of Positions:2-242
Centerline (Pitch) (mm)0.64-24.003
Contact Current Rating (Max) (A)2.5-242
工组温度范围 (°C)-65-150
Thermal Solutions|DAS,DRS 特性:
散热片数量:1-7
Thermal Solutions|CL,HS 特性:
散热片数量:1-7
Thermal Solutions 特性:
散热片数量:1-7
DIPLOMATE|500Series 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
Augat|510SIP 特性:
Number of Positions:3-20
Centerline (Pitch) (mm)2.54
工组温度范围 (°C)-55-125
CompactFlash|HDI 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
CompactFlash 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
PCI EXPRESS|PCIeCard Edge 特性:
Number of Positions:36-280
Centerline (Pitch) (mm)1-1.27
Contact Current Rating (Max) (A)1
工组温度范围 (°C)-55-105
SODIMM|DDR3SODIMM,SKT 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
MiniDIMM|RKS,RVS 特性:
行业:数据中心,消费类电子产品
MiniDIMM|STA 特性:
行业:数据中心,消费类电子产品
DDR2DIMM|FLD,TL 特性:
Number of Positions:240
Centerline (Pitch) (mm)1行
间距 (mm)1.9-6.3
DDR3DIMM|DDR3DIMM,LR 特性:
Centerline (Pitch) (mm)1-2
行间距 (mm)0.95-5.3
DIPLOMATE|CL,PB 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
DDR4DIMM|DDR3DIMM,DDR4DIMM 特性:
行间距 (mm)2.2
Contact Current Rating (Max) (A)0.75
工组温度范围 (°C)-40-85
DDR4DIMM|DDR4DIMM 特性:
行间距 (mm)2.2
Contact Current Rating (Max) (A)0.75
工组温度范围 (°C)-40-85
PGASockets|SKT 特性:
Number of Positions:321-350
端子接触部电镀厚度 (μin)10-15
封装数量12-120
DDR1 and DDR2 SODIMM|DDRSODIMM 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
DDR1 and DDR2 SODIMM|DDRSODIMM,DDR3SODIMM 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
SDCard|RKS,RVS 特性:
Number of Positions:8-9
Centerline (Pitch) (mm)1.1