DIMM|DRD,PB 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
MICRO-EDGE|ME,PB 特性:
Number of Positions:72-80
SODIMM|PB,SODIMM 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
MICRO-EDGE|H,SIMM 特性:
Number of Positions:72-80
DIPLOMATE|800Series 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
MicroPitch Sockets|PKS 特性:
Number of Positions:2-242
Centerline (Pitch) (mm)0.64-24.003
Contact Current Rating (Max) (A)2.5-242
工组温度范围 (°C)-65-150
Thermal Solutions|DAS,DRS 特性:
散热片数量:1-7
Thermal Solutions|CL,HS 特性:
散热片数量:1-7
Thermal Solutions 特性:
散热片数量:1-7
DIPLOMATE|500Series 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
Augat|510SIP 特性:
Number of Positions:3-20
Centerline (Pitch) (mm)2.54
工组温度范围 (°C)-55-125
CompactFlash|HDI 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27