SODIMM|H,SKT 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
OAC,TERMINAL 特性:
PCI EXPRESS|THS 特性:
Number of Positions:36-280
Centerline (Pitch) (mm)1-1.27
Contact Current Rating (Max) (A)1
工组温度范围 (°C)-55-105
DIMM|DDR3 DIMM,LR 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
DDR3DIMM|FST 特性:
Centerline (Pitch) (mm)1-2
行间距 (mm)0.95-5.3
DDR3SODIMM 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
DDR2DIMM|HEE.18,PB 特性:
Number of Positions:240
Centerline (Pitch) (mm)1
行间距 (mm)1.9-6.3
Augat|AD 特性:
Number of Positions:3-20
Centerline (Pitch) (mm)2.54
工组温度范围 (°C)-55-125
PCCard|HDI,STS 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|HDI 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCMCIA|HWIC 特性:
Number of Positions:68-83
Centerline (Pitch) (mm)1.27
行数:2
插槽数:1
PCCard|H 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
SmartCard|SIMConnectors,SIMM 特性:
Number of Positions:6-8
SmartCard|OS 特性:
Number of Positions:6-8
SmartCard|SMA 特性:
Number of Positions:6-8
PCCard|HDI,RRD 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|CD,EJ 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
SmartCard|SM,SMA 特性:
Number of Positions:6-8
PCCard 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|RRD,SKT 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|RC,RE 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
SIMM 特性:
Number of Positions:72-90
SIMM|H 特性:
Number of Positions:72-90
DIPLOMATE|PCN,PKN 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
PCCard|HDI,ME 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|HDI,RSS 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
ExpressCard 特性:
Number of Positions:15
Centerline (Pitch) (mm)0.8
Compact Flash|HD.50,SM 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
SmartCard|PKS 特性:
Number of Positions:6-8
SmartCard 特性:
Number of Positions:6-8