SODIMM|H,SKT 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
OAC,TERMINAL 特性:
PCI EXPRESS|THS 特性:
Number of Positions:36-280
Centerline (Pitch) (mm)1-1.27
Contact Current Rating (Max) (A)1
工组温度范围 (°C)-55-105
DIMM|DDR3 DIMM,LR 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
DDR3DIMM|FST 特性:
Centerline (Pitch) (mm)1-2
行间距 (mm)0.95-5.3
DDR3SODIMM 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
DDR2DIMM|HEE.18,PB 特性:
Number of Positions:240
Centerline (Pitch) (mm)1
行间距 (mm)1.9-6.3
Augat|AD 特性:
Number of Positions:3-20
Centerline (Pitch) (mm)2.54
工组温度范围 (°C)-55-125
PCCard|HDI,STS 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|HDI 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27