DDR3 SODIMM|RKS,RVS 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
MicroPitch Sockets|HS,HSM 特性:
产品系列:AMP
MicroPitch Sockets|MP,PKS 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant
MicroPitch Sockets|PT/SPT,SKT 特性:
Number of Positions:1-320
Centerline (Pitch) (mm)0.8-5.2
Contact Current Rating (Max) (A)1.5-200
工组温度范围 (°C)-55-150
CompactFlash|HPR 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
PCCard|RE 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
DIPLOMATE|SKT,SSR 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
SmartCard|FPC,SC 特性:
Number of Positions:6-8
SDCard|STA 特性:
Number of Positions:8-9
Centerline (Pitch) (mm)1.1
LGA Sockets|LGH,SBP 特性:
Number of Positions:771-3647
Contact Current Rating (Max) (A)0.5
工组温度范围 (°C)-25-105