Thermal Solutions|DAS,DRS 特性:
散热片数量:1-7
Thermal Solutions|CL,HS 特性:
散热片数量:1-7
Thermal Solutions 特性:
散热片数量:1-7
DIPLOMATE|500Series 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
Augat|510SIP 特性:
Number of Positions:3-20
Centerline (Pitch) (mm)2.54
工组温度范围 (°C)-55-125
CompactFlash|HDI 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
CompactFlash 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
PCI EXPRESS|PCIeCard Edge 特性:
Number of Positions:36-280
Centerline (Pitch) (mm)1-1.27
Contact Current Rating (Max) (A)1
工组温度范围 (°C)-55-105
SODIMM|DDR3SODIMM,SKT 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
MiniDIMM|RKS,RVS 特性:
行业:数据中心,消费类电子产品
MiniDIMM|STA 特性:
行业:数据中心,消费类电子产品
DDR2DIMM|FLD,TL 特性:
Number of Positions:240
Centerline (Pitch) (mm)1行
间距 (mm)1.9-6.3
DDR3DIMM|DDR3DIMM,LR 特性:
Centerline (Pitch) (mm)1-2
行间距 (mm)0.95-5.3
DIPLOMATE|CL,PB 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
DDR4DIMM|DDR3DIMM,DDR4DIMM 特性:
行间距 (mm)2.2
Contact Current Rating (Max) (A)0.75
工组温度范围 (°C)-40-85
DDR4DIMM|DDR4DIMM 特性:
行间距 (mm)2.2
Contact Current Rating (Max) (A)0.75
工组温度范围 (°C)-40-85
PGASockets|SKT 特性:
Number of Positions:321-350
端子接触部电镀厚度 (μin)10-15
封装数量12-120
DDR1 and DDR2 SODIMM|DDRSODIMM 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
DDR1 and DDR2 SODIMM|DDRSODIMM,DDR3SODIMM 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
SDCard|RKS,RVS 特性:
Number of Positions:8-9
Centerline (Pitch) (mm)1.1
SIMM|PB 特性:
Number of Positions:72-90
DDR1 and DDR2 SODIMM|PB,PR 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
ThermalSolutions|HS 特性:
散热片数量:1-7
LGASockets|KT,KTT 特性:
Number of Positions:771-3647
Contact Current Rating (Max) (A)0.5
工组温度范围 (°C)-25-105
PGA Sockets|PKA 特性:
Number of Positions:321-350
端子接触部电镀厚度 (μin)10-15
封装数量12-120
PCCard|STS 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|RRD,RSS 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|AMP-HDI,HDI 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
DDR2DIMM|DRD 特性:
Number of Positions:240
Centerline (Pitch) (mm)1
行间距 (mm)1.9-6.3
XFP|XFP 特性:
EU RoHS Compliance:Compliant
产品系列:XFP