SFP|SFP,SFP+ 特性:
标准:INF-8074i
行业:数据通信
ThermalSolutions|HS,HSS 特性:
散热片数量:1-7
PGA Sockets 特性:
Number of Positions:321-350
端子接触部电镀厚度 (μin)10-15
封装数量12-120
General,LGH 特性:
产品系列:AMP
行业:国防军事,航空航天
LGA Sockets 特性:
Number of Positions:771-3647
Contact Current Rating (Max) (A)0.5
工组温度范围 (°C)-25-105
DIPLOMATE|LE 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
DDR1 and DDR2 SODIMM|STS 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
DDR2 DIMM 特性:
Number of Positions:240
Centerline (Pitch) (mm)1
行间距 (mm)1.9-6.3
SODIMM|SKT,U 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
MINI-SPRING SOCKETS|Series2 特性:
插座长度 (mm)3.51-7.82
线缆尺寸 (mm2)0.0404-0.126
Contact Current Rating (Max) (A)3-7.5
工组温度范围 (°C)-65-126
SIMM|PKS 特性:
Number of Positions:72-90
AMPECONOMATE|AMPECONOMATE,AMPPACE 特性:
Number of Positions:10-35
Centerline (Pitch) (mm)2.54-3.96
Contact Current Rating (Max) (A)3
工组温度范围 (°C)-65-125
ThermalSolutions|CL 特性:
散热片数量:1-7
Compact Flash|SC10 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
Compact Flash|HD.50 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
Thermal Solutions|PH,PRHS 特性:
散热片数量:1-7
Thermal Solutions|HS,PKA 特性:
散热片数量:1-7
Thermal Solutions|CL,HA.32 特性:
散热片数量:1-7
DDR3 SODIMM|STA,STA.20 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
DDR3 DIMM 特性:
Centerline (Pitch) (mm)1-2
行间距 (mm)0.95-5.3
DDR3 SODIMM|RKS,RVS 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
MicroPitch Sockets|HS,HSM 特性:
产品系列:AMP
MicroPitch Sockets|MP,PKS 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant
MicroPitch Sockets|PT/SPT,SKT 特性:
Number of Positions:1-320
Centerline (Pitch) (mm)0.8-5.2
Contact Current Rating (Max) (A)1.5-200
工组温度范围 (°C)-55-150
CompactFlash|HPR 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
PCCard|RE 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
DIPLOMATE|SKT,SSR 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
SmartCard|FPC,SC 特性:
Number of Positions:6-8
SDCard|STA 特性:
Number of Positions:8-9
Centerline (Pitch) (mm)1.1
LGA Sockets|LGH,SBP 特性:
Number of Positions:771-3647
Contact Current Rating (Max) (A)0.5
工组温度范围 (°C)-25-105