Thermal Solutions|DAS,DRS 特性:
散热片数量:1-7
Thermal Solutions|CL,HS 特性:
散热片数量:1-7
Thermal Solutions 特性:
散热片数量:1-7
DIPLOMATE|500Series 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
Augat|510SIP 特性:
Number of Positions:3-20
Centerline (Pitch) (mm)2.54
工组温度范围 (°C)-55-125
CompactFlash|HDI 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
CompactFlash 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
PCI EXPRESS|PCIeCard Edge 特性:
Number of Positions:36-280
Centerline (Pitch) (mm)1-1.27
Contact Current Rating (Max) (A)1
工组温度范围 (°C)-55-105
SODIMM|DDR3SODIMM,SKT 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
MiniDIMM|RKS,RVS 特性:
行业:数据中心,消费类电子产品