MiniDIMM|STA 特性:
行业:数据中心,消费类电子产品
DDR2DIMM|FLD,TL 特性:
Number of Positions:240
Centerline (Pitch) (mm)1行
间距 (mm)1.9-6.3
DDR3DIMM|DDR3DIMM,LR 特性:
Centerline (Pitch) (mm)1-2
行间距 (mm)0.95-5.3
DIPLOMATE|CL,PB 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
DDR4DIMM|DDR3DIMM,DDR4DIMM 特性:
行间距 (mm)2.2
Contact Current Rating (Max) (A)0.75
工组温度范围 (°C)-40-85
DDR4DIMM|DDR4DIMM 特性:
行间距 (mm)2.2
Contact Current Rating (Max) (A)0.75
工组温度范围 (°C)-40-85
PGASockets|SKT 特性:
Number of Positions:321-350
端子接触部电镀厚度 (μin)10-15
封装数量12-120
DDR1 and DDR2 SODIMM|DDRSODIMM 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
DDR1 and DDR2 SODIMM|DDRSODIMM,DDR3SODIMM 特性:
EU RoHS Compliance:Compliant,Not Compliant
行业:测试和测量,消费类电子产品
SDCard|RKS,RVS 特性:
Number of Positions:8-9
Centerline (Pitch) (mm)1.1