DDR3 SODIMM|RKS,RVS 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
MicroPitch Sockets|HS,HSM 特性:
产品系列:AMP
MicroPitch Sockets|MP,PKS 特性:
EU RoHS Compliance:Compliant with Exemptions,Compliant
MicroPitch Sockets|PT/SPT,SKT 特性:
Number of Positions:1-320
Centerline (Pitch) (mm)0.8-5.2
Contact Current Rating (Max) (A)1.5-200
工组温度范围 (°C)-55-150
CompactFlash|HPR 特性:
Number of Positions:50
Centerline (Pitch) (mm)1.27
PCCard|RE 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
DIPLOMATE|SKT,SSR 特性:
Number of Positions:6-64
Centerline (Pitch) (mm)2.54
Contact Current Rating (Max) (A)1-3
工组温度范围 (°C)-65-125
SmartCard|FPC,SC 特性:
Number of Positions:6-8
SDCard|STA 特性:
Number of Positions:8-9
Centerline (Pitch) (mm)1.1
LGA Sockets|LGH,SBP 特性:
Number of Positions:771-3647
Contact Current Rating (Max) (A)0.5
工组温度范围 (°C)-25-105
SODIMM|H,SKT 特性:
堆叠高度 (mm)5.2-5.5
行间距 (mm)5.4-6.2
OAC,TERMINAL 特性:
PCI EXPRESS|THS 特性:
Number of Positions:36-280
Centerline (Pitch) (mm)1-1.27
Contact Current Rating (Max) (A)1
工组温度范围 (°C)-55-105
DIMM|DDR3 DIMM,LR 特性:
Number of Positions:100-240
Centerline (Pitch) (mm)1-1.27
行间距 (mm)1.6-1.9
DDR3DIMM|FST 特性:
Centerline (Pitch) (mm)1-2
行间距 (mm)0.95-5.3
DDR3SODIMM 特性:
堆叠高度 (mm)4-9.2
端子接触部电镀厚度 (μm)0.254-0.76
DDR2DIMM|HEE.18,PB 特性:
Number of Positions:240
Centerline (Pitch) (mm)1
行间距 (mm)1.9-6.3
Augat|AD 特性:
Number of Positions:3-20
Centerline (Pitch) (mm)2.54
工组温度范围 (°C)-55-125
PCCard|HDI,STS 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|HDI 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27