DDR2DIMM|HEE.18,PB 特性:
Number of Positions:240
Centerline (Pitch) (mm)1
行间距 (mm)1.9-6.3
Augat|AD 特性:
Number of Positions:3-20
Centerline (Pitch) (mm)2.54
工组温度范围 (°C)-55-125
PCCard|HDI,STS 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|HDI 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCMCIA|HWIC 特性:
Number of Positions:68-83
Centerline (Pitch) (mm)1.27
行数:2
插槽数:1
PCCard|H 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
SmartCard|SIMConnectors,SIMM 特性:
Number of Positions:6-8
SmartCard|OS 特性:
Number of Positions:6-8
SmartCard|SMA 特性:
Number of Positions:6-8
PCCard|HDI,RRD 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
PCCard|CD,EJ 特性:
Number of Positions:40-68
Centerline (Pitch) (mm)0.64-1.27
SmartCard|SM,SMA 特性:
Number of Positions:6-8